Accession Number : ADA189969
Title : Vapor Phase Deposition and Growth of Polyimide Films on Copper.
Descriptive Note : Technical rept.,
Corporate Author : MAINE UNIV AT ORONO LAB FOR SURFACE SCIENCE AND TECHNOLOGY
Personal Author(s) : Grunze, M ; Baxter, J P ; Kong, C W ; Lamb, R N ; Unertl, W N
PDF Url : ADA189969
Report Date : 10 Nov 1987
Pagination or Media Count : 23
Abstract : The formation of thin polymide films from vapor phase deposited 4,4 Oxydianiline (ODA) and Pyromellitic dianhydride (PMDA) was studied by X-ray photoelectron spectroscopy and vibrational spectroscopies. Codeposition of ODA and PMDA onto polycrystalline copper substrates at room temperature, followed by heating in vacuum, led to polymerization and the formation of thermally stable polymide films. Films with thickness ranging from ultra-thin (12-30 A ) to several hundred nanometers thick were prepared by this method. Adhesion of the polymer to the surface involve chemical bonding to fragments of PMDA and ODA initially chemisorbed on the clean metal surface. Keywords: Dielectric films.
Descriptors : *POLYIMIDE PLASTICS, ADHESION, CHEMICAL BONDS, COPPER, DIELECTRIC FILMS, POLYCRYSTALLINE, POLYIMIDE RESINS, POLYMERIZATION, SUBSTRATES, SURFACES, VAPOR DEPOSITION, X RAY PHOTOELECTRON SPECTROSCOPY, INTERFACES, METAL FILMS, CHROMIUM, POLYCRYSTALLINE
Subject Categories : Plastics
Distribution Statement : APPROVED FOR PUBLIC RELEASE