Accession Number : ADA190696
Title : Correlation between Dielectric and Structural Properties during Epoxy Cure.
Descriptive Note : Technical rept. no. 10, Oct 86-Oct 87,
Corporate Author : MASSACHUSETTS INST OF TECH CAMBRIDGE MICROSYSTEMS TECHNOLOGY LABS
Personal Author(s) : Bidstrup, Wayne W ; Bidstrup, Sue A ; Senturia, Stephen D
PDF Url : ADA190696
Report Date : 01 Nov 1987
Pagination or Media Count : 17
Abstract : The relationship between the dielectric properties and the molecular structure of a commercial epoxy resin, Ciba-Geigy's MY720, is reported. The ionic conductivity sigma was measured at several temperatures by microdielectrometry and correlated with the structural parameter, the glass transition temperature Tg, through a modified Williams Landel Ferry formulation where C1 is a constant and C2 and log sigma(Tg) are assumed to be a linear functions of Tg. Keywords: Conductivity, Thermosetting polymers, Williams Landel Ferry equation, Glass transition temperature, Epoxy resins, Amine hardener, Network structure, Microdielectrometry, Differential scanning calorimetry, Loss factor.
Descriptors : *DIELECTRIC PROPERTIES, *EPOXY RESINS, *CURING, CALORIMETRY, CONDUCTIVITY, FUNCTIONS, GLASS, IONS, LINEARITY, LOSSES, MOLECULAR STRUCTURE, NETWORKS, POLYMERS, SCANNING, STRUCTURAL PROPERTIES, THERMOSETTING PLASTICS, TRANSITION TEMPERATURE
Subject Categories : Plastics
Distribution Statement : APPROVED FOR PUBLIC RELEASE