Accession Number : ADA192064

Title :   The Inspection of Metallurgical Bonds in Electronic Systems,

Corporate Author : ADVANCED RESEARCH AND APPLICATIONS CORP SUNNYVALE CA

Personal Author(s) : Smith, Jerel A ; Stanley, James H

PDF Url : ADA192064

Report Date : Feb 1988

Pagination or Media Count : 3

Abstract : Electronic subassemblies are getting more and more difficult to inspect. Integrated circuits (IC's) are being designed with more input/output (I/O) connections spaced closer together. These new designs make the solder-joint inspections more difficult at the same time that joints are being relied upon to accommodate more demanding mechanical requirements. The higher I/O pin count has forced the adoption of surface mount technology (SMT) which places higher demands on the mechanical strength of the solder bonds due to the shorter and less compliant leads, or the elimination of the leads altogether, on the IC package. In addition the high I/O count is leading to IC package designs with pins or pads in the interior as well as around the package perimeter. There is no inspection technique that is currently capable of inspecting solder joint integrity beneath an IC package. Functional testing of an assembly can detect shorts or opens but cannot detect the many flaws that can cause premature failure of the solder bonds.

Descriptors :   *ELECTRONIC EQUIPMENT, *INSPECTION, *INTEGRATED CIRCUITS, BONDED JOINTS, COUNTING METHODS, FAILURE, INPUT OUTPUT PROCESSING, MECHANICAL PROPERTIES, MOUNTS, REQUIREMENTS, SOLDERED JOINTS, SOLDERING, STRENGTH(MECHANICS), SURFACES

Subject Categories : Theoretical Mathematics
      Ammunition and Explosives

Distribution Statement : APPROVED FOR PUBLIC RELEASE