Accession Number : ADA192197
Title : The Inspection of Electronic Metallurgical Bonds.
Descriptive Note : Final rept.,
Corporate Author : ADVANCED RESEARCH AND APPLICATIONS CORP SUNNYVALE CA
Personal Author(s) : Jackson, Bart ; Smith, Jerel ; Stanley, James
PDF Url : ADA192197
Report Date : Feb 1988
Pagination or Media Count : 30
Abstract : The solder bonds in electronic assemblies are an area of increased Non-Destructive Evaluation interest as the number of bonds per assembly increases, the size of the bonds decreases, and the dependence on the bonds for electrical and mechanical performance increases. The current inspection techniques are not detecting many defects, and the inspection techniques are not adequate for the near-term Surface Mount Technology improvements. Computed Tomography is a new NDE technology that is beginning to find its place in industry. This project has surveyed the field of printed circuit board manufacturing to determine the types of flaws that need to be detected to improve the reliability of solder bonds in electronic systems.
Descriptors : *BONDED JOINTS, *COMPUTER APPLICATIONS, *ELECTRONIC EQUIPMENT, *PRINTED CIRCUIT BOARDS, *TOMOGRAPHY, ASSEMBLY, ELECTRICAL PROPERTIES, ELECTRONICS, INDUSTRIES, INSPECTION, MANUFACTURING, MECHANICAL PROPERTIES, METALLURGY, MOUNTS, NONDESTRUCTIVE TESTING, RELIABILITY, SOLDERING, SURFACES
Subject Categories : Fabrication Metallurgy
Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE