Accession Number : ADA193759
Title : Reliability Assessment of Surface Mount Technology (SMT).
Descriptive Note : Rept. for Dec 85-Aug 87,
Corporate Author : ROME AIR DEVELOPMENT CENTER GRIFFISS AFB NY
Personal Author(s) : Bivens, Gretchen A.
Report Date : MAR 1988
Pagination or Media Count : 40
Abstract : This report documents an in-house study that was conducted in order to assess the current reliability problems associated with surface mount technology (SMT). Specific areas investigated included failure modes, design guidelines, reliability prediction techniques and reliability evaluation test methods associated with SMT. A Literature search was conducted and many IR&D programs were reviewed. The results showed a considerable amount of research in the area of SMT failure modes and in the development of SMT design guidelines. The two areas that were deficient were the development of a reliability prediction technique for SMT and the appropriateness of current reliability evaluation test methods. Keywords: Leadless chip carriers; Finite element analysis; Surface mount devices; Solder.
Descriptors : *CHIPS(ELECTRONICS), *MOUNTS, *RELIABILITY, FAILURE, FINITE ELEMENT ANALYSIS, LITERATURE SURVEYS, PREDICTIONS, SURFACES, TEST AND EVALUATION, TEST METHODS.
Subject Categories : Electrical and Electronic Equipment
Containers and Packaging
Distribution Statement : APPROVED FOR PUBLIC RELEASE