Accession Number : ADA195061

Title :   Stress Related Failures Causing Open Metallization.

Descriptive Note : Final rept. Jun 85-Jul 87,

Corporate Author : TEXAS INSTRUMENTS INC DALLAS SEMICONDUCTOR GROUP

Personal Author(s) : Groothuis, Steven K

PDF Url : ADA195061

Report Date : Jan 1988

Pagination or Media Count : 66

Abstract : Non-linear Finite Element Analysis has been used to model stresses and infer stress induced void formation in narrow Al-S; metal lines. Observed failures correlate well with calculated stresses determined by varying intrinsic stress of the passivation, topography, line width and silicon nodule size. Keywords: Aluminum, Sulfur, Modeling, Stress, Finite element analysis, Thin films, Voids, Conductors.

Descriptors :   *FINITE ELEMENT ANALYSIS, *METALLIZING, *NONLINEAR ANALYSIS, ALUMINUM, MODELS, SILICON, STRESSES, SULFUR, THIN FILMS, VOIDS, MATHEMATICAL MODELS, INTEGRATED CIRCUITS, COMPUTER AIDED DIAGNOSIS, MODULUS OF ELASTICITY, COMPRESSIVE PROPERTIES

Subject Categories : Coatings, Colorants and Finishes

Distribution Statement : APPROVED FOR PUBLIC RELEASE