Accession Number : ADA195796

Title :   Laser-Activated Metal Deposition.

Descriptive Note : Final technical rept. 1 Oct 85-31 Dec 87,

Corporate Author : GENERAL ELECTRIC CO SCHENECTADY NY RESEARCH AND DEVELOPMENT CENTER

Personal Author(s) : Cole, H S ; Liu, Y S ; Guida, R ; Rose, J W ; Levinson, L M

PDF Url : ADA195796

Report Date : 31 Jan 1988

Pagination or Media Count : 69

Abstract : A process to selectively deposit copper on polyimide was developed. Laser irradiation of organometallic palladium compounds with a CW argon ion laser at 351 nm was used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution resulted in selective copper deposition. Since only a few monolayers of palladium were needed to catalyze the electroless copper process, fast writing speeds of up to 10 cm/s were achieved. Copper lines with 1.5 micro thickness and resistive of 3 mohm-cm were produced by this technique. (MJM)

Descriptors :   ARGON LASERS, CONTINUOUS WAVE LASERS, COPPER, DEPOSITS, ELECTROLESS PLATING, IONS, IRRADIATION, LASER BEAMS, LAYERS, ORGANOMETALLIC COMPOUNDS, PALLADIUM, PALLADIUM COMPOUNDS, POLYIMIDE RESINS, SAMPLING, VELOCITY, WRITING

Subject Categories : Inorganic Chemistry
      Lasers and Masers

Distribution Statement : APPROVED FOR PUBLIC RELEASE