Accession Number : ADA197928

Title :   Bonding at Metal-Ceramic Interfaces in Hybrid Materials.

Descriptive Note : Annual rept. 1 Sep 86-30 Nov 87,

Corporate Author : CORNELL UNIV ITHACA NY DEPT OF MATERIALS SCIENCE AND ENGINEERING

Personal Author(s) : Raj, Rishi

Report Date : 30 JUN 1988

Pagination or Media Count : 37

Abstract : The objective of this research project is to investigate the fundamental mechanical properties of the metal-ceramic interface, and to relate those properties to the atomic structure of interface. Until this point we have emphasized the development of innovative techniques for (i) measuring the shear strength of the interface, and (ii) the interfacial energy of the metal-ceramic interface. In the present phase these techniques are being applied to model metal-ceramic systems. The ultimate shear strength of the silica-copper interface has been measured to be in the range 570 MPa to 1670 MPa. This interface had been suspected to be strong but these are the first quantitative measurements of its shear strength. The interfacial energy of the interface is being measured by measuring the contact angle between the metal and the ceramic. It has been found that poor wetting between the copper-alumina interface causes the copper film to become unstable and break up into small spheres. Keywords: Interfaces, Metal-ceramic, Composites. (jes)

Descriptors :   *CERAMIC MATERIALS, *MICROSTRUCTURE, COPPER, SHEAR STRENGTH, COMPOSITE MATERIALS.

Subject Categories : Ceramics, Refractories and Glass
      Properties of Metals and Alloys

Distribution Statement : APPROVED FOR PUBLIC RELEASE