Accession Number : ADA269224

Title :   Knowledge Sources for an Intelligent MCM Analyzer.

Descriptive Note : Final technical rept. Jan 91-Jan 92,

Corporate Author : MASSACHUSETTS UNIV AMHERST DEPT OF MECHANICAL ENGINEERING

Personal Author(s) : Grosse, Ian R. ; Katragadda, Prasanna ; Jog, Anagha

Report Date : JUN 1993

Pagination or Media Count : 74

Abstract : This research project resulted in the development of: (1) an intelligent methodology for finite element modeling and analysis of multichip modules (MCMs) for the purpose of rapid mechanical reliability assessment; (2) specific software modules, termed MCMs; and (3) a prototype proof-of-concept computer-based system that integrated these knowledge sources. The approach featured an object-oriented representation of the MCMs and their components. The modeling and analysis methodology itself was represented by the blackboard problem-solving paradigm in which individual experts solve specific tasks involved in finite element modeling and analysis of MCMs and post their results on a common blackboard accessible by the other experts. Several software modules from Sandia National Laboratory were used as well as the contractor developing a three-dimensional thermal analysis finite element code, called FEECAP3D, which includes sophisticated techniques for estimating the finite element discretization error All of these software codes were integrated into a blackboard-based proof-of-concept computer system called the Intelligent MCM Analyzer (IMCMA). Finite element analysis, Thermal analysis, Electronic packaging.

Descriptors :   *FINITE ELEMENT ANALYSIS, *THERMAL ANALYSIS, ANALYZERS, COMPUTERS, CONTRACTORS, ELECTRONICS, ERRORS, METHODOLOGY, PACKAGING, PROBLEM SOLVING, PROTOTYPES, RELIABILITY, THREE DIMENSIONAL, ARTIFICIAL INTELLIGENCE, CHIPS(ELECTRONICS), MATHEMATICAL MODELS.

Subject Categories : Computer Programming and Software
      Numerical Mathematics
      Thermodynamics
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE