Accession Number : ADA282586

Title :   High Tc Superconductivity: Thin Film Materials and Device Research.

Descriptive Note : Final rept. 1 Oct 88-30 Sep 91,

Corporate Author : CORNELL UNIV ITHACA NY SCHOOL OF APPLIED AND ENGINEERING PHYSICS

Personal Author(s) : Buhrman, R. A.

Report Date : 30 SEP 1991

Pagination or Media Count : 7

Abstract : This project was concerned with the growth and study of high quality HTS thin films, with the principal HTS material focus being on YBa2Cu3O7, and with research aimed at incorporating such thin film materials into suitable configurations for experiments that closely examine the feasibility of employing HTS thin films for superconducting electronic device applications. Particular attention was given to examining the process of HTS thin film nucleation and growth on non-lattice matched substrates. Here the goal was to develop techniques that can yield high quality HTS thin films with no measurable density of detrimental high angle grain boundaries. The other major focus was concerned with careful, detailed studies of the character and properties of high angle tilt boundaries in YBa2Cu307 thin films. The most significant results that were achieved under this contract include: an improved understanding and control of the growth of oriented HTS thin films on non-lattice matched substrates; an extensive electron microscopy and ultra-high-resolution analytical study of the microstructure and stoichiometry of high angle tilt boundaries in YBa2Cu3O7 thin films.

Descriptors :   *SUPERCONDUCTIVITY, *HIGH TEMPERATURE SUPERCONDUCTORS, *THIN FILMS, *COMPOSITE MATERIALS, YTTRIUM, BARIUM, COPPER, OXIDES, CONFIGURATIONS, ELECTRONIC EQUIPMENT, NUCLEATION, GROWTH(GENERAL), SUBSTRATES, GRAIN BOUNDARIES, ANGLES, ELECTRON MICROSCOPY, HIGH RESOLUTION, MICROSTRUCTURE, STOICHIOMETRY, JOSEPHSON JUNCTIONS, EXPERIMENTAL DATA, TILT.

Subject Categories : Electricity and Magnetism
      Thermodynamics
      Solid State Physics
      Laminates and Composite Materials

Distribution Statement : APPROVED FOR PUBLIC RELEASE