Accession Number : ADA291119
Title : Thermal Management of Electronics.
Descriptive Note : Annual status rept.,
Corporate Author : NAVAL WEAPONS SUPPORT CENTER CRANE IN
Personal Author(s) : Beasley, Kevin G.
PDF Url : ADA291119
Report Date : DEC 1990
Pagination or Media Count : 7
Abstract : The objective of this work is to use new materials and techniques to improve the thermal performance of electronic systems. The composite work will focus on corrosion protection of aluminum/graphite heatsinks and development of techniques to adequately machine continuous fiber composite material. Metal and polymer matrix composites will be developed for SEM heatsinks. Composite cardrails will also be developed using high thermal conductivity graphite fibers. Using the fact that composite materials can be CTE controlled, these materials will be used to constrain epoxy PWBs. This task will also look at various plating materials to attempt to decrease thermal contact resistance between the module guide rib and the enclosure cardrail. Alternate substrate materials, such as aluminum nitride, will be investigated for ceramic PWBs. The use of diamond will also be investigated to improve thermal performance. (jg)
Descriptors : *THERMAL PROPERTIES, *MANAGEMENT, *ELECTRONIC EQUIPMENT, METALS, FIBERS, SCANNING ELECTRON MICROSCOPES, ALUMINUM COMPOUNDS, PERFORMANCE(ENGINEERING), MATERIALS, POLYMERS, COMPOSITE MATERIALS, CORROSION INHIBITION, DIAMONDS, GRAPHITE, MATRIX MATERIALS, SUBSTRATES, THERMAL CONDUCTIVITY, TEMPERATURE CONTROL, PRINTED CIRCUITS, EPOXY COMPOSITES, NITRIDES, HEAT SINKS, PLATING, THERMAL RESISTANCE, CONTINUOUS PROCESSING.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE