Accession Number : ADA292911
Title : Intelligent Finite Element Submodeling of Multichip Modules for Reliability Analysis.
Descriptive Note : Final technical rept. Jan 93-Jan 94,
Corporate Author : MASSACHUSETTS UNIV AMHERST DEPT OF MECHANICAL ENGINEERING
Personal Author(s) : Grosse, Ian R. ; Sheehy, Michael ; Katragadda, Prasanna ; Raman, Shankar
PDF Url : ADA292911
Report Date : DEC 1994
Pagination or Media Count : 122
Abstract : Modeling methodologies were developed, implemented, and tested for both rapid thermal finite element analysis of small-scale integrated circuit features in MCMs, and for thermal stress finite element analysis of chip-to-substrate interconnects. A three-step sequential analysis methodology was developed that is initiated with a macroscope thermal analysis of the entire MCM package. The macroscope finite element thermal analysis is then followed by two successive finite element thermal submodels of the hottest die first and then of the hottest die microfeature. In this manner, the thermal analysis process mathematically zooms into the hottest IC microfeature without resorting to supercomputer-size finite element models of the MCM. A two-step sequential thermal-stress finite element submodeling analysis procedure was also developed for thermally induced stress analysis of the most highly stressed wirebond or TAB interconnect in an MCM package. For automation purposes, both the IC thermal submodeling and the interconnect elastostatic submodeling methodologies were implemented into an existing blackboard-based, object-oriented MCM software design tool called the Intelligent MCM Analysis (IMCMA). (AN)
Descriptors : *FINITE ELEMENT ANALYSIS, *CHIPS(ELECTRONICS), *THERMAL ANALYSIS, *MODULES(ELECTRONICS), MATHEMATICAL MODELS, ALGORITHMS, SOFTWARE ENGINEERING, STRESS ANALYSIS, COMPUTER AIDED DESIGN, STATIC LOADS, COMPARISON, INTEGRATED CIRCUITS, SEQUENTIAL ANALYSIS, THREE DIMENSIONAL, MICROELECTRONICS, ARTIFICIAL INTELLIGENCE, RELIABILITY(ELECTRONICS), THERMAL STRESSES, PACKAGED CIRCUITS.
Subject Categories : Electrical and Electronic Equipment
Computer Programming and Software
Distribution Statement : APPROVED FOR PUBLIC RELEASE