Accession Number : ADA293117
Title : Intelligent Computer Based Reliability Assessment of Multichip Modules.
Descriptive Note : Final technical rept. Apr 93-Apr 94,
Corporate Author : MASSACHUSETTS UNIV AMHERST DEPT OF MECHANICAL ENGINEERING
Personal Author(s) : Grosse, Ira R. ; Katragadda, Prasanna ; Bhattacharya, Sandeepan ; Kulkarni, Sarang
PDF Url : ADA293117
Report Date : DEC 1994
Pagination or Media Count : 66
Abstract : A novel methodology for design assessment of MCM packages is presented using finite element analysis and a Taguchi based design of experiments technique. This methodology enables the design engineer to rapidly estimate the quality of candidate designs and thereby select better designs. The proposed method allows the designer to generate a robust finite element model of the physical process which is also numerically efficient, to identify the design parameters that are critically important to the performance of the design and also to investigate the effect of tolerances on the significant design parameters. A detailed description is presented along with a MCM design example to illustrate the proposed method.
Descriptors : *MATHEMATICAL MODELS, *CHIPS(ELECTRONICS), *RELIABILITY(ELECTRONICS), *FACTORIAL DESIGN, THERMOMECHANICS, OPTIMIZATION, SYSTEMS ENGINEERING, PREDICTIONS, PHYSICAL PROPERTIES, EXPERIMENTAL DESIGN, FINITE ELEMENT ANALYSIS, QUALITY, MODULES(ELECTRONICS).
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE