Accession Number : ADA293183

Title :   Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules (ASEMs).

Descriptive Note : Technical rept. 22 Sep 94-14 Mar 95,

Corporate Author : DAVID SARNOFF RESEARCH CENTER PRINCETON NJ

Personal Author(s) : Thaler, Barry J. ; Kumar, A. H. ; Prabhu, A. N.

PDF Url : ADA293183

Report Date : 13 MAR 1995

Pagination or Media Count : 38

Abstract : The quarterly progress for the Ceramic/Metal Composite Circuit-Board-Level Technology for Application Specific Electronic Modules is described in this report. Data is reported for the following tasks: Metal Core Fabrication, LTCC Ceramic Development, Thin Film Interconnect Structure Integration, Multilayer Interaction, and Reliability Studies. jg

Descriptors :   *METAL MATRIX COMPOSITES, *CERAMIC MATERIALS, *MODULES(ELECTRONICS), *CIRCUIT BOARDS, LOW TEMPERATURE, CORES, INTERACTIONS, LAYERS, THIN FILMS, FABRICATION, RELIABILITY, INTEGRATION, CIRCUIT INTERCONNECTIONS, FIRING(CERAMICS).

Subject Categories : Electrical and Electronic Equipment
      Inorganic Chemistry
      Physical Chemistry
      Ceramics, Refractories and Glass

Distribution Statement : APPROVED FOR PUBLIC RELEASE