Accession Number : ADA294194
Title : Correlation of Wafer Level QA Tests with Functional Device Yield and Accelerated Life Test Results.
Descriptive Note : Final technical rept. Mar 92-Aug 93,
Corporate Author : UNIVERSITY OF SOUTHERN CALIFORNIA MARINA DEL REY INFORMATION SCIENCES INST
Personal Author(s) : Tyree, Vance C.
PDF Url : ADA294194
Report Date : FEB 1995
Pagination or Media Count : 49
Abstract : This report covers work that was to correlate wafer level test structure tests with life tests by utilizing test structures collocated with a RAM-like device. Wafer level tests for oxide breakdown, electromigration, and hot carrier degradation were conducted on a total of six wafer lots from three vendors. Functional testing of the RAM-like device yielded just over six hundred devices to be packaged for the life test. The data from the wafer level and life testing indicate that the oxide breakdown wafer level test is able to be correlated to both functional yield and life test results. This study was not able to conclusively correlate the wafer level electromigration or hot carrier testing to the life test results. Further study with a much larger sample size and a longer life test needs to be performed to further address this issue. jg
Descriptors : *CORRELATION, *QUALITY ASSURANCE, *WAFERS, *ACCELERATED TESTING, TEST AND EVALUATION, DEGRADATION, CHARGE CARRIERS, INTEGRATED CIRCUITS, SEMICONDUCTORS, HIGH ENERGY, OXIDES, VENDORS, LIFE TESTS, IONIC CURRENT, ISOTOPE SEPARATION.
Subject Categories : Electrical and Electronic Equipment
Logistics, Military Facilities and Supplies
Distribution Statement : APPROVED FOR PUBLIC RELEASE