Accession Number : ADA298735

Title :   Multichip Modules Including Processing: A Literature Survey.

Descriptive Note : Final rept. Oct 93-Sep 94,

Corporate Author : ARMY RESEARCH LAB ADELPHI MD

Personal Author(s) : Griffin, Timothy E.

PDF Url : ADA298735

Report Date : AUG 1995

Pagination or Media Count : 26

Abstract : In a review of the literature on multichip modules (MCMs), the focus was on the types of MCMs and processes required to fabricate them. The use of MCMs for connecting integrated circuit chips can improve integration density and potentially improve speed, reliability, size, and life-cycle cost, if MCMs are fabricated in sufficient volume. Particular processes produce each MCM type. Each MCM type has advantages and drawbacks. Known good dice (or chips), proper design, and adequate production volume must be evaluated for each fabrication approach.

Descriptors :   *CHIPS(ELECTRONICS), *INTEGRATED CIRCUITS, *MODULES(ELECTRONICS), DENSITY, PRODUCTION, LITERATURE SURVEYS, INPUT OUTPUT PROCESSING, FABRICATION, SUBSTRATES, RELIABILITY, INTEGRATION, CIRCUIT INTERCONNECTIONS, LIFE CYCLE COSTS, HYBRID CIRCUITS.

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE