Accession Number : ADA299577

Title :   On Mechanical Properties of Materials by Thermal Wave Imaging.

Descriptive Note : Final rept.,

Corporate Author : WAYNE STATE UNIV DETROIT MI INST FOR MANUFACTURING RESEARCH

Personal Author(s) : Thomas, R. L. ; Favro, L. D. ; Kuo, P. K.

PDF Url : ADA299577

Report Date : 24 JUL 1995

Pagination or Media Count : 25

Abstract : A three year program of research was proposed to: (1) Utilize recently developed WSU fast line- scan techniques to study the temperature distribution in the vicinity of the crack tips of propagating brittle fracture cracks in structural polymer composites; (2) To utilize Wayne State University's well established box-car video thermal wave imaging technique for the purpose of studying adhesive bond strength, and (3) Exploit the concept of vector lock-in video thermal wave imaging for mechanical and thermal response of semiconductors. jg p.6

Descriptors :   *THERMAL PROPERTIES, *MECHANICAL PROPERTIES, *COMPOSITE MATERIALS, SCANNING, IMAGE PROCESSING, TEMPERATURE, DISTRIBUTION, POLYMERS, COMPOSITE STRUCTURES, SEMICONDUCTORS, STRENGTH(MECHANICS), FRACTURE(MECHANICS), CRACK PROPAGATION, BRITTLENESS, RESPONSE, WAVES, ADHESIVE BONDING.

Subject Categories : Laminates and Composite Materials
      Optics
      Mechanics
      Thermodynamics
      Radiofrequency Wave Propagation

Distribution Statement : APPROVED FOR PUBLIC RELEASE