Accession Number : ADA299577
Title : On Mechanical Properties of Materials by Thermal Wave Imaging.
Descriptive Note : Final rept.,
Corporate Author : WAYNE STATE UNIV DETROIT MI INST FOR MANUFACTURING RESEARCH
Personal Author(s) : Thomas, R. L. ; Favro, L. D. ; Kuo, P. K.
PDF Url : ADA299577
Report Date : 24 JUL 1995
Pagination or Media Count : 25
Abstract : A three year program of research was proposed to: (1) Utilize recently developed WSU fast line- scan techniques to study the temperature distribution in the vicinity of the crack tips of propagating brittle fracture cracks in structural polymer composites; (2) To utilize Wayne State University's well established box-car video thermal wave imaging technique for the purpose of studying adhesive bond strength, and (3) Exploit the concept of vector lock-in video thermal wave imaging for mechanical and thermal response of semiconductors. jg p.6
Descriptors : *THERMAL PROPERTIES, *MECHANICAL PROPERTIES, *COMPOSITE MATERIALS, SCANNING, IMAGE PROCESSING, TEMPERATURE, DISTRIBUTION, POLYMERS, COMPOSITE STRUCTURES, SEMICONDUCTORS, STRENGTH(MECHANICS), FRACTURE(MECHANICS), CRACK PROPAGATION, BRITTLENESS, RESPONSE, WAVES, ADHESIVE BONDING.
Subject Categories : Laminates and Composite Materials
Radiofrequency Wave Propagation
Distribution Statement : APPROVED FOR PUBLIC RELEASE