Accession Number : ADA299600
Title : Techniques for On-Wafer Reliability Testing for MMICs.
Descriptive Note : Final rept. Aug 91-Feb 94,
Corporate Author : TRW SPACE AND ELECTRONICS GROUP REDONDO BEACH CA
Personal Author(s) : Saito, Yoshio
PDF Url : ADA299600
Report Date : SEP 1995
Pagination or Media Count : 88
Abstract : Two Compliant Interconnected Structures (CISs) have been designed and fabricated to enable accelerated DC life tests to be performed at the wafer level. The first CIS was fabricated using Kapton polyimide, the second with borosilicate glass. Both structures are capable of providing bias to the GaAs wafers at 24O C for an extended period of time. Three inch wafers that contain process test characterization vehicles, a distribution amplifier, and three stage amplifiers, were used to demonstrate the feasibility of the techniques.
Descriptors : *INTEGRATED CIRCUITS, *LIFE TESTS, GALLIUM ARSENIDES, ELASTIC PROPERTIES, GLASS, FEASIBILITY STUDIES, POLYMERIC FILMS, WAFERS, MONOLITHIC STRUCTURES(ELECTRONICS), DIRECT CURRENT, ACCELERATED TESTING, BORON OXIDES, SILICATES, MICROWAVE AMPLIFIERS, POLYIMIDE RESINS.
Subject Categories : Solid State Physics
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE