Accession Number : ADA299852

Title :   The Reliability of Laser Reflowed Sn-Ag Solder Joints.

Descriptive Note : Quarterly rept. no. 3,

Corporate Author : RENSSELAER POLYTECHNIC INST TROY NY

Personal Author(s) : Raeder, C. H. ; Millard, D. L. ; Messler, R. W.

PDF Url : ADA299852

Report Date : 1993

Pagination or Media Count : 14

Abstract : The greatest concern regarding reliability of solder joints is thermomechanical fatigue (TMF). TMF results from constrained temperature changes in the environment of the electronic package and/or temperature gradients induced by power cycling of the package. Typically, electronic packages and substrates have different thermal expansion coefficients, so temperature changes result in elastic strains in the package and substrate and elastic/plastic strains in the solder joining the two together. (MM)

Descriptors :   *ELECTRONIC EQUIPMENT, *MILITARY PUBLICATIONS, *SOLDERED JOINTS, *TIN ALLOYS, THERMOMECHANICS, STIFFNESS, ELASTIC PROPERTIES, SUBSTRATES, STRAIN(MECHANICS), LASER APPLICATIONS, TEMPERATURE GRADIENTS, THERMAL EXPANSION, PLASTIC PROPERTIES, FATIGUE(MECHANICS), THERMAL FATIGUE, DIRECTIVES, SILVER, PRINTED CIRCUIT BOARDS, SOLDERING.

Subject Categories : Administration and Management
      Electrical and Electronic Equipment
      Couplers, Fasteners, and Joints

Distribution Statement : APPROVED FOR PUBLIC RELEASE