Accession Number : ADA300143

Title :   Liquefied Metal Jet Program (LMJP).

Descriptive Note : Quarterly research and development status rept. 15 Jul-15 Oct 95,

Corporate Author : TEXAS INSTRUMENTS INC DALLAS DEFENSE SYSTEMS AND ELECTRONICS GROUP

Personal Author(s) : Dringenburg, Nick ; Smith, Charles ; DuBois, Patrick ; Terrill, R. E. ; Priest, John

PDF Url : ADA300143

Report Date : 12 OCT 1995

Pagination or Media Count : 8

Abstract : Many significant technical issues have been overcome. Generation of test and evaluation coupons of 63/37 solder circuit patterns on copper coupons have been accomplished on the Phase I system. Final fabrication and assembly of the copper system has been completed tested, and several attempts to generate copper spheres have been made. (MM)

Descriptors :   *COPPER, *SOLDERING, *LIQUID METALS, DEFLECTION, FABRICATION, SUBSTRATES, ETCHING, COSTS, CIRCUITS.

Subject Categories : Metallurgy and Metallography

Distribution Statement : APPROVED FOR PUBLIC RELEASE