Accession Number : ADA300780
Title : 0N Mechanical Properties of Materials by Thermal Wave Imaging.
Descriptive Note : Final rept. 1 Jun 92-31 May 95,
Corporate Author : WAYNE STATE UNIV DETROIT MI INST FOR MANUFACTURING RESEARCH
Personal Author(s) : Thomas, R. L. ; Favro, L. D. ; Kuo, P. K.
PDF Url : ADA300780
Report Date : 24 JUL 1995
Pagination or Media Count : 25
Abstract : Research was carried out to: (1) Utilize WSU fast imaging techniques to study the temperature distribution in the vicinity of the crack tips of propagating cracks in polymer composites; (2) Utilize Wayne State University's thermal wave imaging techniques for studying adhesive bond strength; and (3) Exploit the concept of vector lock-in video thermal wave imaging for mechanical and thermal response of semiconductors. Key results included: (1) a Physical Review letter: "The Thermal Conductivity of Isotopically Modified Single Crystal Diamond,"; (2) Thermal wave imaging and analysis (to be published) of crack initiation and propagation in polymers; (3) Thermal wave imaging of fracture in metal/metal adhesive bonds.
Descriptors : *MECHANICAL PROPERTIES, *CRACK PROPAGATION, *TEMPERATURE GRADIENTS, *BONDED JOINTS, *THERMAL IMAGES, *ADHESIVE BONDING, THERMAL PROPERTIES, POLYMERS, COMPOSITE MATERIALS, CRACKING(FRACTURING), DIAMONDS, SINGLE CRYSTALS, SEMICONDUCTORS, STRENGTH(MECHANICS), FRACTURE(MECHANICS), INFRARED IMAGES, THERMAL CONDUCTIVITY, METAL METAL BONDS, PLENUM CHAMBERS.
Subject Categories : Adhesives, Seals and Binders
Distribution Statement : APPROVED FOR PUBLIC RELEASE