Accession Number : ADA301263

Title :   Multi-Transducer Dummy Unit Evaluation of Polystyrene Bead Foam as an Encapsulant for Electronic Packages,

Corporate Author : ALLIED BENDIX AEROSPACE KANSAS CITY MO

Personal Author(s) : Swanson, G. D.

PDF Url : ADA301263

Report Date : SEP 1980

Pagination or Media Count : 59

Abstract : A dummy electronic assembly without electronic components was used to measure loadings and deflections caused by 0.2, 0.3, 0.4, 0.5 and 0.6 g/cm3 densities of polystyrene bead foam during fusion and thermal cycling. Previously developed and proven transducers showed that the lower three densities caused low and safe loads and deflections, but that the highest two densities must be used with care for fragile electronic components.

Descriptors :   *POLYSTYRENE, *ENCAPSULATION, *BEADS, *EXPANDED PLASTICS, TEST AND EVALUATION, ELECTRONIC EQUIPMENT, DEFLECTION, CYCLES, HEATING, HIGH DENSITY, PACKAGING, TRANSDUCERS, LOW DENSITY, ASSEMBLY, MULTIPLE OPERATION.

Subject Categories : Electrical and Electronic Equipment
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE