Accession Number : ADA301449
Title : Evaluation of Multilayer Printed Wiring Boards by Metallographic Techniques. An Illustrated Guide to the Preparation and Inspection of Plated-Through Hole Test Coupons Based on the Requirements of MIL-P-55llOD.
Corporate Author : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION GREENBELT MD GODDARD SPACE FLIG HT CENTER
Personal Author(s) : Jellison, Jane
PDF Url : ADA301449
Report Date : MAY 1986
Pagination or Media Count : 73
Abstract : This work is an illustrated handbook containing the rationale and procedure for the evaluation of multilayer printed wiring board construction integrity with respect to plated-through holes in accordance with the requirements of MIL-P-55l lOD, "Printed Wiring Boards." Itis intended as a practical aid for those concerned with determining the construction integrity of multilayer boards for high reliability applications. Photomicrographs of cross-sectioned holes illustrate defect types, acceptable and unacceptable conditions, and methods of measurement. A procedure for specimen preparation is given, and appropriate paragraphs of the military specification are included and explained. (AN)
Descriptors : *PRINTED CIRCUIT BOARDS, TEST AND EVALUATION, MILITARY REQUIREMENTS, MICROSTRUCTURE, LAYERS, CRACKS, FABRICATION, ETCHING, VOIDS, DEFECTS(MATERIALS), HOLES(OPENINGS), CROSS SECTIONS, EPOXY LAMINATES, INSPECTION, QUALITY ASSURANCE, JUNCTIONS, HANDBOOKS, RELIABILITY(ELECTRONICS), THERMAL CYCLING TESTS, THERMAL STRESSES, METALLOGRAPHY, HIGH RELIABILITY, PHOTOMICROGRAPHY, MICROCHANNEL PLATES.
Subject Categories : Electrical and Electronic Equipment
Metallurgy and Metallography
Distribution Statement : APPROVED FOR PUBLIC RELEASE