Accession Number : ADA301839

Title :   Plastics in Electronic Packaging.

Corporate Author : SOCIETY OF PLASTICS ENGINEERS BROOKFIELD CENTER CT

PDF Url : ADA301839

Report Date : 24 OCT 1968

Pagination or Media Count : 58

Abstract : CONTENTS: Epoxy Molding Compounds Characterization and Classification

Descriptors :   *ELECTRONIC EQUIPMENT, *PACKAGING, LIQUIDS, POLYMERS, ENERGY, INTEGRATED CIRCUITS, OXYGEN, DEPOSITION, PRECISION, STANDARDS, ENCAPSULATION, INDEXES, RATINGS, CIRCUITS, IRRADIATION, EPOXY COMPOUNDS, PLASTICS, ELECTRICAL EQUIPMENT, FLAMMABILITY, MOLDING MATERIALS, MOLDING TECHNIQUES.

Subject Categories : Containers and Packaging
      Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE