Accession Number : ADA302334

Title :   Proceedings of the International Electronic Circuit Packing Symposium (2 nd) on Advances in Electronic Circuit Packaging. Volume 2,

Corporate Author : COLORADO UNIV AT BOULDER

Personal Author(s) : Walker, Gerald A.

PDF Url : ADA302334

Report Date : 1962

Pagination or Media Count : 342

Descriptors :   *MICROELECTRONICS, *PACKAGING, *MINIATURE ELECTRONIC EQUIPMENT, AVIONICS, SYMPOSIA, SUBMARINE EQUIPMENT, ACCELERATION, MODULAR CONSTRUCTION, SEMICONDUCTORS, CIRCUIT INTERCONNECTIONS, LIGHTWEIGHT, ENCAPSULATION, ELECTRICAL NETWORKS, HEAT SINKS, PRINTED CIRCUIT BOARDS, SOLID STATE ELECTRONICS, TELEMETER SYSTEMS, PACKAGED CIRCUITS, BALLISTIC MISSILE SUBMARINES.

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE