Accession Number : ADA302335

Title :   Proceedings of the International Electronic Circuit Packaging Symposium (3rd) on Advances in Electronic Circuit Packaging Held at Boulder, Colorado on 15-17 August 1962. Volume 3,

Corporate Author : COLORADO UNIV AT DENVER

Personal Author(s) : Rosine, Lawrence L.

PDF Url : ADA302335

Report Date : 1963

Pagination or Media Count : 465

Descriptors :   *INTEGRATED CIRCUITS, *MICROELECTRONICS, *PACKAGING, AVIONICS, DIGITAL SYSTEMS, SYMPOSIA, ECONOMIC ANALYSIS, THIN FILMS, DISPLAY SYSTEMS, THERMAL ANALYSIS, CIRCUIT INTERCONNECTIONS, MODULES(ELECTRONICS), CONVECTION(HEAT TRANSFER), DESIGN CRITERIA, MINIATURE ELECTRONIC EQUIPMENT, GUIDED MISSILE COMPONENTS, ELECTRICAL NETWORKS, PACKAGED CIRCUITS, AIR COOLED, OCEANOGRAPHIC EQUIPMENT.

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE