Accession Number : ADA304028

Title :   Micromechanics of Advanced Materials Materials. A Symposium in Honor of Professor James C. M. Li's 70th Birthday Held in Cleveland, Ohio on October 29 - November 2, 1995.

Descriptive Note : Final rept.,

Corporate Author : MINERALS METALS AND MATERIALS SOCIETY WARRENDALE PA

Personal Author(s) : Chu, S. N.

Report Date : DEC 1995

Pagination or Media Count : 540

Abstract : Major topics covered in this conference include the following: (1) DISLOCATION MECHANICS; (2) MICROMECHANISMS OF FRACTURE; (3) MICROMECHANICS OF FATIGUE AND DEFORMATION; (4) MECHANICS OF ADVANCED MATERIALS; (5) MICROMECHANICS OF ENVIRONMENTAL EFFECTS; (6) MECHANICS OF COMPOSITE MICROSTRUCTURES; and (7) MICROMECHANICS OF THIN FILMS. (MM)

Descriptors :   *METALS, *DEFORMATION, *FIBER REINFORCED COMPOSITES, *THIN FILMS, *FRACTURE(MECHANICS), *CERAMIC MATERIALS, *FATIGUE(MECHANICS), *MICROMECHANICS, STRESS STRAIN RELATIONS, COMPUTERIZED SIMULATION, LOAD DISTRIBUTION, MECHANICAL PROPERTIES, SYMPOSIA, ALUMINUM ALLOYS, SPECTROSCOPY, LAMINATES, HETEROJUNCTIONS, CERAMIC MATRIX COMPOSITES, CRACKING(FRACTURING), SHAPE, ELASTIC PROPERTIES, COPPER ALLOYS, SINGLE CRYSTALS, EPITAXIAL GROWTH, TOUGHNESS, SUBSTRATES, CRYSTALLIZATION, EMBRITTLEMENT, SEMICONDUCTORS, NUCLEATION, GLASS, VOIDS, STRENGTH(MECHANICS), IRON, ENVIRONMENTAL IMPACT, COATINGS, CROSSLINKING(CHEMISTRY), CRACK PROPAGATION, DEFECTS(MATERIALS), BRITTLENESS, DISLOCATIONS, COPPER, ANISOTROPY, SILICON, ISOTROPISM, RESIDUAL STRESS, BARRIERS, CREEP, PLASTIC PROPERTIES, NICKEL ALLOYS, DUCTILITY, LATTICE DYNAMICS, BORON, SILICON CARBIDES, THERMAL STRESSES, REINFORCING MATERIALS, EUTECTIC COMPOSITES, TITANIUM ALLOYS, GRAIN BOUNDARIES, SUPERALLOYS, CYCLIC LOADS, ELASTOPLASTICITY, ATOMIC STRUCTURE, MAGNESIUM ALLOYS, MARTENSITE, INTERMETALLIC COMPOUNDS, CARBON STEELS, MICROCRACKING, NANOTECHNOLOGY.

Subject Categories : Ceramics, Refractories and Glass
      Laminates and Composite Materials
      Properties of Metals and Alloys
      Mechanics
      Electrical and Electronic Equipment
      Coatings, Colorants and Finishes

Distribution Statement : APPROVED FOR PUBLIC RELEASE