Accession Number : ADA304317
Title : BN-Al(X)Ga(1-X)N Based Heterostructure Field Effect Transistor Devices for High Temperature (350 deg C) Electronics Applications.
Descriptive Note : Final rept. 15 Aug 93-14 Aug 95,
Corporate Author : APA OPTICS INC BLAINE MN
Personal Author(s) : Kahn,
PDF Url : ADA304317
Report Date : DEC 1995
Pagination or Media Count : 38
Abstract : This report summarizes the progress made on the BN-Al(x)Ga(1-x)N based Heterostructure Field Effect Transistor (HFET) development program under contract number F49620-93-C-0059. The goal of this program is to develop high temperature heterostructure insulating gate (HIG) FET devices for integrated circuits operating in harsh environments. In particular, the insulator materials proposed for the device structure included CVD BN/AIN. While the HIGFET processed with the MIS structures employing BN/AIN and Si3N4 as the insulators yielded low transconductances, tremendous progresses have been made on the optimization of AlGaN/GaN based FET structure growth and the following device processing. These are highlighted by the operation of AlGaN/GaN based heterostructure FETs (HFETs) at 300 deg C. The same device also exhibited a cutoff frequency(f sub T) and maximum frequency of oscillation (fmax) of 22 GHz and 70 GHz at room temperature with a reasonable DC transconductance (23 mS/mm). jg p5
Descriptors : *ELECTRONICS, *HIGH TEMPERATURE, *FIELD EFFECT TRANSISTORS, *BORON NITRIDES, FREQUENCY, OPTIMIZATION, MATERIALS, GROWTH(GENERAL), INSULATION, INTEGRATED CIRCUITS, NITRIDES, ROOM TEMPERATURE, HETEROGENEITY, GALLIUM, OSCILLATION, DIRECT CURRENT, TRANSCONDUCTANCE.
Subject Categories : Electrical and Electronic Equipment
Laminates and Composite Materials
Distribution Statement : APPROVED FOR PUBLIC RELEASE