Accession Number : ADA304346
Title : Investigation of High Temperature Electronic Packaging Based on Borosilicate Glass.
Descriptive Note : Final rept. 24 Aug 94-30 Nov 95,
Corporate Author : STRATEGIC ANALYSIS INC ARLINGTON VA
Personal Author(s) : Cole, Eric D.
PDF Url : ADA304346
Report Date : JAN 1996
Pagination or Media Count : 12
Abstract : Strategic Analysis, Inc. (SA), in collaboration with George Mason University (GMU), demonstrated feasibility of several aspects of a novel packaging concept for SiC devices that could withstand temperatures in excess of 650 deg C. SA proved the feasibility of laser welding for attaching SiC devices to a transparent substrate. This concept eliminates the need for intermetallic solders for bonding and die attachment while utilizing pass under lead-throughs. These package simplifications provide an alternate solution to CTE mismatch problems found in typical hybrid ceramic devices. Since this is a dominant failure mechanism, laser welded devices have inherent stability at necessary operating temperatures. Further effort will see full development of hermetic sealed laser welded SiC device packages. Conformal coatings used for seal can provide simple yet either thermally conductive or insulative protection to circuits. Predicted performance of this novel package is well beyond 650 deg C based on reduced failure points. This new packaging scheme will permit SiC devices to be inserted into multi-chip module format, thus increasing the commercial and military use of SiC devices. jg p1
Descriptors : *HIGH TEMPERATURE, *ELECTRONIC EQUIPMENT, *GLASS, *PACKAGING, *BORON OXIDES, *SILICATES, STRATEGIC ANALYSIS, CHIPS(ELECTRONICS), TRANSPARENCE, SUBSTRATES, DIES, WELDS, COATINGS, FEASIBILITY STUDIES, PROTECTION, MODULES(ELECTRONICS), HYBRID SYSTEMS, ATTACHMENT, CIRCUITS, FAILURE(MECHANICS), SILICON CARBIDES, SEALED SYSTEMS, HERMETIC SEALS, LASER WELDING, CERAMIC BODIES, CONFORMAL STRUCTURES.
Subject Categories : Electrical and Electronic Equipment
Ceramics, Refractories and Glass
Containers and Packaging
Distribution Statement : APPROVED FOR PUBLIC RELEASE