Accession Number : ADA304422

Title :   Low Temperature Curing of a Nitrile-Epoxy Adhesive.

Descriptive Note : Final rept.,

Corporate Author : BENDIX CORP KANSAS CITY MO KANSAS CITY DIV

Personal Author(s) : Tira, J. S.

PDF Url : ADA304422

Report Date : APR 1981

Pagination or Media Count : 23

Abstract : Adhesive strength and glass transition temperature were correlated with cure times at 85 deg C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85 deg C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures. jg p4

Descriptors :   *LOW TEMPERATURE, *CURING, *EPOXY COMPOSITES, *NITRILES, *ADHESIVES, REMOVAL, HIGH TEMPERATURE, GLASS, ROOM TEMPERATURE, TRANSITION TEMPERATURE, MOISTURE, SHEAR STRENGTH, POLYETHYLENE.

Subject Categories : Adhesives, Seals and Binders
      Inorganic Chemistry
      Laminates and Composite Materials
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE