Accession Number : ADA304434

Title :   National Technical Conference on More Plastics Growth, the Answer to Transportation in the 80's Held in Detroit, Michigan on 6-8 November 1979.

Corporate Author : SOCIETY OF PLASTICS ENGINEERS BROOKFIELD CENTER CT

PDF Url : ADA304434

Report Date : NOV 1979

Pagination or Media Count : 331

Abstract : Session topics include the following: (1) New Materials for RIM (Reaction Injection Molding); (2) Thermoplastic Injection Molding; (3) New Engineering Plastics; (4) Thermoforming and Stamping; (5) Structural Foam and Polyester Injection Molding; (6) Materials Characterization and Testing; (7) Thermoformed and Other Applications; (8) New Processing Technology for RIM; (9) New Materials for SMC (Sheet Molding Compound); (10) Bright Decoration Update; (11) Energy and Federal Regulations; (12) New Special Purpose Materials; (13) New Technology for SMC; (14) Assembly Techniques Update; (15) Update on Plastic Fuel Tanks; (16) New Technology for Structural Components; (17) Future Trends in Auto Plastics; and (18) New Technology for Bumper Systems. (MM)

Descriptors :   *COMPOSITE MATERIALS, *PASSENGER VEHICLES, *PLASTICS, *FOAM, *INJECTION MOLDING, *MOLDING TECHNIQUES, *REINFORCED PLASTICS, THERMAL PROPERTIES, FILAMENT WOUND CONSTRUCTION, FIBERGLASS, SYMPOSIA, ROBOTICS, AUTOMATION, MARKETING, POLYMERS, FIBER REINFORCED COMPOSITES, NYLON, POLYAMIDE PLASTICS, ELASTOMERS, GRAPHITE, TOUGHNESS, GLASS, STRENGTH(MECHANICS), IMPACT STRENGTH, COATINGS, POLYPROPYLENE, WETTING, THERMOPLASTIC RESINS, FUEL TANKS, FATIGUE(MECHANICS), ASSEMBLY, POLYURETHANE RESINS, EPOXY RESINS, REGULATIONS, SPUTTERING, REINFORCING MATERIALS, POLYESTER PLASTICS, STRUCTURAL COMPONENTS, WELDING, POLYETHYLENE PLASTICS, SANDWICH CONSTRUCTION, THERMOSETTING PLASTICS, HOT WORKING, OLEFIN RESINS, URETHANES, METALLIZING, MOLDING MATERIALS, POLYETHYLENE TEREPHTHALATE.

Subject Categories : Laminates and Composite Materials
      Plastics
      Surface Transportation and Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE