Accession Number : ADA304608

Title :   Electromagnetic Environmental Effects Modeling of Advanced Packaged Modules.

Descriptive Note : Final rept. Dec 92-Aug 94,

Corporate Author : STANFORD RESEARCH INST MENLO PARK CA

Personal Author(s) : Kenneally, Daniel J.

PDF Url : ADA304608

Report Date : NOV 1995

Pagination or Media Count : 78

Abstract : This report presents the results of an investigation of electromagnetic effects in boundary scan and other scan test sturctures embedded as test access ports (TAPs). The TAPs and test scan structures of interest in this study are those used in contemporary ICs and advanced packaged MCMs to enhance testability. This effort addresses the susceptibility issues associated with embedding boundary scan test circuits in MCMs, and its effect on the latent electromagnetic susceptibility of its host linear and digital circuits.

Descriptors :   *LEAKAGE(ELECTRICAL), *ELECTROMAGNETIC SUSCEPTIBILITY, *PORTS(OPENINGS), LINEAR SYSTEMS, BOUNDARIES, ELECTROMAGNETIC ENVIRONMENTS, PACKAGED CIRCUITS.

Subject Categories : Electricity and Magnetism
      Electromagnetic Shielding

Distribution Statement : APPROVED FOR PUBLIC RELEASE