Accession Number : ADA304731

Title :   Aging Study of an Adhesive and a Prepreg.

Descriptive Note : Final rept. 18 Sep 80-18 Dec 81,

Corporate Author : WESTINGHOUSE RESEARCH AND DEVELOPMENT CENTER PITTSBURGH PA

Personal Author(s) : Sanjana, Z. N.

PDF Url : ADA304731

Report Date : FEB 1982

Pagination or Media Count : 40

Abstract : Prepregs and adhesive films which are B-stage products are used extensively in the aerospace, electrical, and communications industries. They consist of a partially reacted mixture of monomers which have been impregnated into the reinforcement. During shipping and storage, prior to use, the reactions will continue. The amount of reaction or 'age' of the prepreg will depend on the conditions (temperature, humidity and time) that it has been exposed to. This report provides data and results of studies performed on American Cyanamid's FM300 adhesive film aged under diverse conditions of temperature, time and humidity. At various times during the aging, physical properties of the adhesive were measured and the following methods were used to track the age of the adhesive: (1) dielectric analysis (DA), (2) dynamic mechanical analysis (DMA), and (3) a simple, easy to use time-temperature integrating device (TTW) which is carried with the material and provides a visual observation of the time and temperature exposure of the adhesive. It was found that DA, DMA, and the TTW can be used to follow the age of the adhesive and that they can be used as overage indicators to tell the user when the adhesive has lost its useful life. The indication by the TTW is less exact than by the other two methods. JG P4

Descriptors :   *AGING(MATERIALS), *PREPREGS, *ADHESIVES, TEMPERATURE, MECHANICAL PROPERTIES, EXPOSURE(GENERAL), PHYSICAL PROPERTIES, DIELECTRICS, FILMS, MIXTURES, NONMETALS, MONOMERS, COMMUNICATION AND RADIO SYSTEMS, VISUAL PERCEPTION, STORAGE, INDICATORS, REINFORCING MATERIALS, HUMIDITY.

Subject Categories : Adhesives, Seals and Binders
      Inorganic Chemistry
      Laminates and Composite Materials
      Mechanics

Distribution Statement : APPROVED FOR PUBLIC RELEASE