Accession Number : ADA305065

Title :   Cure Cycle Evaluation for Multilayer Printed Wiring Boards.

Descriptive Note : Topical rept.,

Corporate Author : BENDIX CORP KANSAS CITY MO KANSAS CITY DIV

Personal Author(s) : Lula, J. W.

PDF Url : ADA305065

Report Date : JUN 1980

Pagination or Media Count : 14

Abstract : The cure cycle for multilayer printed wiring boards (PWBs) made from general-purpose, fire-retardant epoxy/glass (GF) material has been evaluated for the optimum delamination resistance at soldering temperatures. The results show that, for the epoxy resin system used to manufacture multilayer PWBs at Bendix Kansas City, a wide range of cure cycle variations has a minimal effect on delamination resistance.

Descriptors :   *CURING, *EPOXY RESINS, *PRINTED CIRCUIT BOARDS, TEST AND EVALUATION, TEMPERATURE, OPTIMIZATION, LAYERS, LAMINATES, RESISTANCE, CYCLES, PRINTED CIRCUITS, RANGE(EXTREMES), DELAMINATION, FIRE RESISTANT MATERIALS, SOLDERING, GLASS REINFORCED PLASTICS.

Subject Categories : Electrical and Electronic Equipment
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE