Accession Number : ADA305249

Title :   Cure Analysis of An Adhesive Primer,

Corporate Author : BENDIX CORP KANSAS CITY MO KANSAS CITY DIV

Personal Author(s) : Hubach, J. M.

PDF Url : ADA305249

Report Date : AUG 1976

Pagination or Media Count : 17

Abstract : Selection of a cure cycle is generally based on the results of extensive physical properties tests. The advent of dielectric analysis provides the means of accurately predicting cure schedules without this extensive testing. Dielectric analysis is based on the reaction of the dipoles within a polymer to an alternating electric field. As the field alternates the dipoles attempt to swivel in step but are restricted because of their relatively fixed position within the polymeric structure. Capacitance is the measure of the dipole's ability to align and dissipation is the power lost in alignment. For a thermosetting polymer, dissipation versus time curves provide an insight into the curing mechanism and can be correlated to known physical and chemical changes. The dissipation versus temperature curves provide a fingerprint of the curing polymer and extent of cure. jg p8

Descriptors :   *PRIMERS, *CURING, *ADHESIVES, TEST AND EVALUATION, TEMPERATURE, EXPERIMENTAL DATA, CHEMICAL PROPERTIES, CHEMICALS, PHYSICAL PROPERTIES, POLYMERS, GRAPHS, DIELECTRICS, DISSIPATION, ELECTRIC FIELDS, CHEMICAL REACTIONS, DIPOLES, MOLECULAR STRUCTURE, CAPACITANCE, TIME STUDIES, THERMOSETTING PLASTICS.

Subject Categories : Adhesives, Seals and Binders
      Physical Chemistry
      Coatings, Colorants and Finishes
      Plastics
      Electricity and Magnetism
      Atomic and Molecular Physics and Spectroscopy

Distribution Statement : APPROVED FOR PUBLIC RELEASE