Accession Number : ADA305270
Title : High Temperature Syntactic Foam. Revision.
Descriptive Note : Final rept.,
Corporate Author : BENDIX CORP KANSAS CITY MO KANSAS CITY DIV
Personal Author(s) : McIlroy, H. M.
PDF Url : ADA305270
Report Date : JUL 1977
Pagination or Media Count : 65
Abstract : Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but even the urethane exceeded the design goals. Foams with high and low thermal conductivity were developed and their material properties were measured. The low conductivity was achieved using glass microbubble fillers and high conductivity was achieved using carbon microsphere fillers. jg p5
Descriptors : *HIGH TEMPERATURE, *SYNTACTIC FOAMS, HIGH RATE, POLYMERS, GLASS, CARBON, HIGH STRENGTH, BUBBLES, THERMAL CONDUCTIVITY, LOW LEVEL, LOW DENSITY, SILICONES, IMIDES, FILLERS, PHENOLIC PLASTICS, URETHANES, POLYIMIDE RESINS, MICROSPHERES, POLYBENZIMIDAZOLE.
Subject Categories : Laminates and Composite Materials
Distribution Statement : APPROVED FOR PUBLIC RELEASE