Accession Number : ADA305371

Title :   Ceramic/Metal Composite Circuit Board Level Technology for Application Specific Electronic Modules (ASEMs).

Descriptive Note : Technical rept. 15 Dec 95-14 Mar 96,

Corporate Author : DAVID SARNOFF RESEARCH CENTER PRINCETON NJ

Personal Author(s) : Thaler, Barry J. ; Sreeram, A. N. ; Tormey, E. S. ; Pendrick, V. A. ; Dynys, J. M.

PDF Url : ADA305371

Report Date : 14 MAR 1996

Pagination or Media Count : 40

Abstract : The task objective was to transfer the LTCC-M technology to a merchant circuit supplier, Alcoa Electronic Packaging, Inc. This task will require a steady supply of several custom glasses that were developed during the Phase 1 program. One or more glass producers will be qualified to supply materials to the David Sarnoff Research Center or its design to produce LTCC-M circuit boards and packages. The Phase 1 technology will be interactively transferred to Alcoa Electronic Packaging, who will be qualified by the fabrication of test structures and technology demonstration modules.

Descriptors :   *TECHNOLOGY TRANSFER, *CIRCUIT BOARDS, ELECTRONIC EQUIPMENT, FABRICATION, METAL MATRIX COMPOSITES, SUBSTRATES, GLASS, MODULES(ELECTRONICS), PACKAGING, SUPPLIES, SOLID STATE ELECTRONICS.

Subject Categories : Electrical and Electronic Equipment
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE