Accession Number : ADA306026
Title : Properties of Polystyrene Bead Foam as an Encapsulant for Electronic Packages.
Descriptive Note : Final rept.,
Corporate Author : BENDIX CORP KANSAS CITY MO KANSAS CITY DIV
Personal Author(s) : Fossey, D. J. ; Dyer, D. C. ; Holland, L. L. ; Swanson, G. D. ; Walburn, K. A.
PDF Url : ADA306026
Report Date : APR 1981
Pagination or Media Count : 14
Abstract : Polystyrene bead foam (PSBF) was evaluated as an encapsulant for electronic packages. Various properties of PSBF pertinent to the expected environmental conditioning of a prototype electronic package were determined and evaluated for their effects on individual electronic components, within the package. It was determined that PSBF densities of 0.2 to 0.4 g/cm3 provided adequate protection without damaging fragile electronic components. PSBF densities above 0.4 g/cm3 provide adequate protection from the shock and vibration spectra evaluated, but could damage fragile electronic components during the encapsulation process and thermal cycling. Buildup of electrostatic voltage during encapsulation can be reduced to safe levels by grounding the case of the electronic package. Only the 0.6 g/cm3 PSBF could be made impervious to moisture penetration. (AN)
Descriptors : *POLYSTYRENE, *PACKAGING, *FOAM, THERMOMECHANICS, STRESS STRAIN RELATIONS, DENSITY, TENSILE STRENGTH, VIBRATION, STRESS ANALYSIS, DAMAGE ASSESSMENT, ELECTRONIC EQUIPMENT, VOLTAGE, ENCAPSULATION, MOISTURE, SHOCK TESTS, COMPRESSIVE STRENGTH, MICROCIRCUITS, THERMAL CYCLING TESTS, THERMAL STRESSES, ELECTROSTATICS.
Subject Categories : Plastics
Containers and Packaging
Distribution Statement : APPROVED FOR PUBLIC RELEASE