Accession Number : ADA306619
Title : Reliable IC Package Design Guidelines.
Descriptive Note : Final rept. Jul 90-Jul 92,
Corporate Author : MARYLAND UNIV COLLEGE PARK
Personal Author(s) : Arora, Ajay ; Barker, Donald ; Christou, Aris ; Dasgupta, Abhijit ; Huang, Mike
Report Date : JUL 1992
Pagination or Media Count : 1
Abstract : This effort was intended to transition design and assembly contraint information and mathematical analyses of microelectronic packaging into a consolidated set of design guidelines which would enable the selection of materials and processes suitable for anticipated assembly, testing, handling, operational, and environmental stress levels. The guidelines were intended to be used later in developing computer aided design software. The Statement of Work required the University of Maryland (CALCE) to analyze common failure modes occurring in conventional package types. Package design guidelines and models, including theoretical and practical considerations, were to be documented such that a package design engineer could understand and implement them. All assumptions made were to be documented. An example calculation was required for each model to insure reasonableness. Rome Laboratory has chosen not to publish this report. In light of the limited practicality of the work submitted in the draft final report and the limited supporting technical basis, Rome Laboratory will not publish this report.
Descriptors : *COMPUTER AIDED MANUFACTURING, COMPUTER PROGRAMMING, FAILURE, PROTOTYPES, INTEGRATED CIRCUITS, MATHEMATICAL ANALYSIS, MICROELECTRONICS, PACKAGING, INSTRUCTIONS, CIRCUIT ANALYSIS.
Subject Categories : Computer Programming and Software
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE