Accession Number : ADA306976

Title :   Low Dielectric Constant Insulators and Gold Metallization for GHz Multi-Chip Modules. Part 2.

Descriptive Note : Final rept.,

Corporate Author : GEORGIA INST OF TECH ATLANTA

Personal Author(s) : Kohl, Paul ; Bidstrup, Sue A. ; Hertling, David

PDF Url : ADA306976

Report Date : 1995

Pagination or Media Count : 203

Abstract : The goal of this program is to investigate new dielectrics, metals and processes for the fabrication of multichip modules which hold the promise of exceptional electrical performance in the GHz region in addition to high yield and high reliability. The low dielectric constant insulators are being evaluated through the fabrication of in-situ test structures using noble metals. In the course of doing this evaluation, a simple process for gold or silver MCMs has been investigated.

Descriptors :   *FABRICATION, *MODULES(ELECTRONICS), CHIPS(ELECTRONICS), DIELECTRIC FILMS, DIELECTRIC PROPERTIES, POLYMERIC FILMS, GOLD, RELIABILITY(ELECTRONICS), HIGH RELIABILITY, METALLIZING, ELECTRICAL INSULATION.

Subject Categories : Mfg & Industrial Eng & Control of Product Sys
      Solid State Physics

Distribution Statement : APPROVED FOR PUBLIC RELEASE