Accession Number : ADA307042
Title : Compressive Behavior of Plates Fabricated from Glass Filaments and Epoxy Resin.
Descriptive Note : Technical note,
Corporate Author : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION HAMPTON VA LANGLEY RESEARCH CEN TER
Personal Author(s) : Davis, John G., Jr. ; Zender, George W.
PDF Url : ADA307042
Report Date : APR 1967
Pagination or Media Count : 35
Abstract : Young's modulus, buckling stress, and maximum strength were determined experimentally for 15 glass-filament- reinforced plastic plates of laminated isotropic construction containing either 12 or 18 laminae. Experimentally determined values of Young's modulus and buckling stress are in reasonable agreement with theoretical calculations. The stress-unit-shortening curve for the plates in the post-buckling region can adequately be predicted by conventional theory for metallic plates. However, lamination occurs at loads below the theoretical compressive strength predicted by an effective width formula that is often used to predict the maximum strength of metal plates. In using an effective width formula to predict maximum strength, it was assumed that failure occurs when the edge stress of the buckled plate equals the delamination stress of the unbuckled compression test specimen. On the basis of strength and modulus data obtained in this study, it is shown that the glass-epoxy composite is competitive as a lightweight material with aluminum in applications where plate buckling strength or crushing strength is the design criterion.
Descriptors : *GLASS FIBERS, *EPOXY RESINS, *COMPRESSIVE PROPERTIES, *GLASS REINFORCED PLASTICS, FILAMENT WOUND CONSTRUCTION, SPACECRAFT, FIBER REINFORCED COMPOSITES, MODULUS OF ELASTICITY, GLASS, STRENGTH(MECHANICS), PLATES, ALUMINUM, BUCKLING, AEROSPACE CRAFT, LIGHTWEIGHT, FILAMENTS, METAL PLATES, FAILURE(MECHANICS), COMPRESSIVE STRENGTH, DELAMINATION, CRUSHING, REINFORCED PLASTICS.
Subject Categories : Refractory Fibers
Laminates and Composite Materials
Distribution Statement : APPROVED FOR PUBLIC RELEASE