Accession Number : ADA307119
Title : Embedding Materials for Modular Assemblies: A Partially Annotated Bibliography.
Descriptive Note : Special Bibliography,
Corporate Author : LOCKHEED MISSILES AND SPACE CO INC SUNNYVALE CA
Personal Author(s) : Pierce, C. M.
PDF Url : ADA307119
Report Date : MAR 1963
Pagination or Media Count : 97
Abstract : Modular packaging of electronics assemblies is a means of enhancing the dependability of equipment which is designed to operate in extreme environments. The proper selection of a plastic embedding material for a particular situation is, therefore, an important aspect in the design of dependable modules. The primary purpose of this bibliography is that of providing information on materials which can be utilized for the embedment of electronics assemblies. References are arranged alphabetically by author. Separate indexes for corporate author, secondary author, and subject are included at the end of the bibliography. The period of coverage dates from 1950 through June 1962.
Descriptors : *CASTING, *EPOXY RESINS, *PLASTICS, *EMBEDDING SUBSTANCES, HIGH TEMPERATURE, BIBLIOGRAPHIES, ELECTRICAL PROPERTIES, STRENGTH(MECHANICS), CERAMIC MATERIALS, DIELECTRIC PROPERTIES, PACKAGING, EMBEDDING, THERMOPLASTIC RESINS, INDEXES, CURING, EPOXY COMPOSITES, POLYURETHANE RESINS, ADHESIVES, POLYESTER PLASTICS, PHENOLIC PLASTICS, PACKAGED CIRCUITS, URETHANES.
Subject Categories : Plastics
Distribution Statement : APPROVED FOR PUBLIC RELEASE