Accession Number : ADA307453

Title :   Cryogenic/High Temperature Structural Adhesives.

Descriptive Note : Contractor rept.,

Corporate Author : TRW SYSTEMS GROUP REDONDO BEACH CA

Personal Author(s) : Vaughan, R. W. ; Sheppard, C. H.

PDF Url : ADA307453

Report Date : JAN 1974

Pagination or Media Count : 72

Abstract : This Final Report describes the work performed during this program to develop a structural adhesive system which possesses useful properties over a 20 deg K (-423 deg F) to 589 deg K (600 deg F) temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ II (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.

Descriptors :   *HIGH TEMPERATURE, *CRYOGENICS, *ADHESIVES, *STRUCTURAL COMPONENTS, THERMAL PROPERTIES, TEMPERATURE, AGING(MATERIALS), STRUCTURAL PROPERTIES, POLYMERS, THERMAL EXPANSION, BONDED JOINTS, PHENYL RADICALS, THERMAL SHOCK, ADHESIVE BONDING, SHEAR STRENGTH, POLYIMIDE RESINS, POLYBENZIMIDAZOLE, QUINOXALINES, THIAZOLES.

Subject Categories : Adhesives, Seals and Binders
      Polymer Chemistry
      Thermodynamics

Distribution Statement : APPROVED FOR PUBLIC RELEASE