Accession Number : ADA309297
Title : Adhesion of Polymers to Tungsten as Studied by Field Ion Microscopy.
Descriptive Note : Technical note,
Corporate Author : NATIONAL AERONAUTICS AND SPACE ADMINISTRATION CLEVELAND OH LEWIS RESEARCH CEN TER
Personal Author(s) : Brainard, William A. ; Buckley, Donald H.
PDF Url : ADA309297
Report Date : OCT 1971
Pagination or Media Count : 34
Abstract : Mechanical contacts with polytetrafluoroethylene (PTFE) and polyimide polymer (PI) contacting tungsten field ion microscope emitter tips were conducted in vacuum. The metal polymer interface was examined on an atomic scale by helium field ion microscopy. Mechanical transfer was observed upon simple touch contact of the polymer materials to tungsten. The transferred polymers were stable even at the high field necessary for helium ionization, thus implying a strong chemical bonding to the metal surface. The mechanical contact stresses orient the transferred material on the tungsten surface in a radial manner from the center of contact. With sufficient load the PTFE and PI cause deformation of the tungsten. On the tungsten (110) plane, individual molecular clusters can be resolved.
Descriptors : *POLYMERS, *ADHESION, *TUNGSTEN, *FIELD ION MICROSCOPY, STRESSES, METALS, MECHANICAL PROPERTIES, INTERFACES, MOLECULES, MATERIALS, DEFORMATION, VACUUM, SURFACES, ETHYLENE, CHEMICAL BONDS, CLUSTERING, FLUORINE, IONIZATION, HELIUM, TRANSFER, TOUCH, POLYIMIDE RESINS.
Subject Categories : Polymer Chemistry
Adhesives, Seals and Binders
Electricity and Magnetism
Distribution Statement : APPROVED FOR PUBLIC RELEASE