Accession Number : ADA310562
Title : Reliable Application of Multichip Modules.
Corporate Author : RELIABILITY ANALYSIS CENTER GRIFFISS AFB NY
Personal Author(s) : Farrell, John ; Denson, William
Report Date : SEP 1995
Pagination or Media Count : 160
Abstract : This is the second in a series of publications from RAC dealing with best commercial practices for 'Part Application and Reliability.' The document addresses the advantages and disadvantages of using hybrid microcircuits and multichip modules while describing technology features. The importance of technology/vendor assessments are stressed and evaluation procedures are discussed. Other attributes which lead to the successful implementation of their use such as testing (environmental, electrical, strategy) failure modes and mechanisms, known-good-die and chip interconnection and fabrication techniques are presented.
Descriptors : *CHIPS(ELECTRONICS), *MODULES(ELECTRONICS), *MICROCIRCUITS, *RELIABILITY(ELECTRONICS), *HYBRID CIRCUITS, TEST AND EVALUATION, STRESSES, METHODOLOGY, COMMERCE, FABRICATION, CIRCUIT INTERCONNECTIONS, PACKAGING, VENDORS, FAILURE(MECHANICS), CIRCUIT TESTERS, TECHNICAL INFORMATION CENTERS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE