Accession Number : ADA311145
Title : Optically Assisted Three Dimensional Packaging for Multichip Module Applications.
Descriptive Note : Final rept. 29 Apr 93-8 Aug 95,
Corporate Author : PHYSICAL OPTICS CORP TORRANCE CA
Personal Author(s) : Wang, Michael
PDF Url : ADA311145
Report Date : JUN 1996
Pagination or Media Count : 116
Abstract : This report presents a board-to-board optical interconnect system for 3-D packaging of multichip module applications. The interconnect prototype demonstrates both waveguide-backplane-fiber interconnects and fiber ribbon interconnects for interboard applications. On the fiber-ribbon-based board-to-board interconnects, distributed feedback laser arrays are used as signal transmitters. PIN type photodetector arrays are used for optical-to-electrical signal conversion at the receiver board. On the waveguide-backplane-fiber interconnects, channel waveguide electrooptic modulator arrays were used as signal transmitters that convert chip electrical signals to optical signals. These devices will potentially have a much lower cost and will operate at a much higher speed for use in computing systems and other high-speed electronic instruments such as signal generators, oscilloscopes, signal amplifiers, and transceiver modules.
Descriptors : *CHIPS(ELECTRONICS), *PROTOTYPES, *THREE DIMENSIONAL, *PACKAGING, VELOCITY, OPTICS, LOW COSTS, ELECTRONIC EQUIPMENT, ARRAYS, LASERS, FEEDBACK, SIGNALS, ELECTRICITY, MODULES(ELECTRONICS), INSTRUMENTATION, TRANSMITTERS, PHOTODETECTORS, PINS, TRANSMITTER RECEIVERS, AMPLIFIERS, SIGNAL GENERATION, OSCILLOSCOPES, DISTRIBUTED AMPLIFIERS.
Subject Categories : Electrical and Electronic Equipment
Containers and Packaging
Distribution Statement : APPROVED FOR PUBLIC RELEASE