Accession Number : ADA311636

Title :   Plastic Package Availability (PPA) Program.

Descriptive Note : Final technical rept. Oct 92-Nov 95.

Corporate Author : NATIONAL SEMICONDUCTOR CORP SANTA CLARA CA

PDF Url : ADA311636

Report Date : NOV 1995

Pagination or Media Count : 372

Abstract : The objectives and goal are to investigate contemporary technology and provide a better understanding for the potential use of plastic encapsulated microcircuits; (PEM) in military system. In addition to the main thrust of evaluating PEM via accelerated life-testing; mold-compound material studies, sensor development, and fielded system failure analysis comprise a comprehensive program. p372

Descriptors :   *PLASTICS, *MICROCIRCUITS, *PACKAGED CIRCUITS, DETECTORS, FAILURE, CHIPS(ELECTRONICS), COATINGS, AVAILABILITY, ENCAPSULATION, SYSTEMS ANALYSIS, EPOXY COMPOUNDS, LIFE TESTS, MOLDINGS, ACCELERATED TESTING, DIE CASTING.

Subject Categories : Plastics
      Electrical and Electronic Equipment
      Containers and Packaging

Distribution Statement : APPROVED FOR PUBLIC RELEASE