Accession Number : ADA318132
Title : Rome Laboratory Analysis of Components for Electronic Technologies for Cleaning in 1996 and Beyond,
Corporate Author : ROME LAB ROME NY
Personal Author(s) : Moore, Benjamin A. ; Burns, Daniel ; Farrier, Clarence ; Gilmour, Duance ; Koziarz, Nancy
PDF Url : ADA318132
Report Date : OCT 1996
Pagination or Media Count : 56
Abstract : In the past, the manufacture of military microelectronics employed ozone depleting substances (ODS) during removal of solder fluxes from printed circuit (PC) boards. These ODS are environmentally unfriendly and were banned from use (Montreal Protocol) starting 1 Jan 96. Alternate flux removal technologies were studied by a Tri-Service, NASA, EPA, Industry, and Academia (GTRI) team. RL/ERDR was the Air Force representative on this team and was tasked with analysis of components from PC boards that had been processed with alternative cleaning methods and then stressed per test schedule. This effort served as a feasibility demonstration of producing reliable military microelectronics without the use of ODS. All boards in the test matrix were assembled with the different soldering technologies under study and were cleaned with the various chemistries proposed to replace ODS currently used. The matrix includes Mil, commercial, plastic and special ceramic coated dual NAND gates, Op-amps, and timer devices. Environmental Step-Stress (ESS) testing of boards was completed and selected parts removed for analysis at RL/EEDR. Within the limited scope of the examinations and testing, no clear cleaning chemistry dependent reliability or potential reliability problems were detected.
Descriptors : *CLEANING COMPOUNDS, ELECTRONICS, METHODOLOGY, LABORATORY TESTS, AIR POLLUTION, POLLUTION ABATEMENT, PRINTED CIRCUIT BOARDS, SOLDERING FLUXES.
Subject Categories : Solvents, Cleaners, and Abrasives
Distribution Statement : APPROVED FOR PUBLIC RELEASE