Accession Number : ADA320420
Title : Folded Interconnection Network Development.
Descriptive Note : Final rept. 15 Sep 92-14 Sep 96,
Corporate Author : BDM INTERNATIONAL INC ARLINGTON VA
Personal Author(s) : Chistensen, Marc P. ; Haney, Michael W.
PDF Url : ADA320420
Report Date : 14 SEP 1996
Pagination or Media Count : 113
Abstract : The objective of the Folded Interconnection Network Development (FIND) program was to combine the rapidly emerging vertical cavity' surface emitting laser (VCSEL) based "smart pixel" technology with a new free-space optical interconnection (FSOI) architecture which maximally exploits the ability of three dimensional free space optics to overcome the interconnection bottlenecks of multiprocessor systems. To focus the research, ultrahigh throughput (-Tbit/sec) packet switching was selected as the key application area. The, FIND program analytical results included a comparison of FSOI-based approaches with the traditional chip-multi-chip-module/printed circuit board metallic interconnection hierarchy. This analysis yielded fundamental scaling laws based on the geometrical constraints associated with implementing high bisection bandwidth networks. The results proved that FSOI provides orders of magnitude advantage in size, weight, and power consumption for multiprocessor networks with bisection bandwidths greater than about 1 Tbit/sec. The experimental portions of the FIND program focused on the optomechanical issues related to the MCM based retroreflective architecture. A one lens per chip design philosophy was adopted. Key optical elements of the package were evaluated with one dimensional and two dimensional arrays of VCSELs. An optical interconnection module was then designed and fabricated. The module achieved 10 micron resolution and registration accuracy across an entire 10 X 10 cm multichip substrate.
Descriptors : *CIRCUIT INTERCONNECTIONS, *MULTIPROCESSORS, *OPTICAL CIRCUITS, OPTICAL PROPERTIES, NETWORKS, RETROREFLECTORS, CHIPS(ELECTRONICS), SCALING FACTOR, THROUGHPUT, ARCHITECTURE, OPTICAL EQUIPMENT COMPONENTS, ENERGY CONSUMPTION, PRINTED CIRCUIT BOARDS, LENSES, PACKET SWITCHING.
Subject Categories : Electrooptical and Optoelectronic Devices
Distribution Statement : APPROVED FOR PUBLIC RELEASE