Accession Number : ADA321082

Title :   Grounding and Bonding for Commercial and Government Buildings Conforming to Telecommunications Infrastructure Standards - A Background Report.

Descriptive Note : Final rept.,

Corporate Author : HULL (JOSEPH A) BOULDER CO

Personal Author(s) : Jamil, Iftikhar

PDF Url : ADA321082

Report Date : JUN 1993

Pagination or Media Count : 131

Abstract : The purpose of this report is to provide a history of the development and a content summary of the referenced standards for those readers who have not had the benefit of participating in the Working Groups or Sub-working Groups that meet regularly to develop the recommended standards. Telecommunications, as used in this report, refers to all forms of information that are conveyed electronically within the building (e.g., voice, data, video, alarms, environmental control, security, audio). The report will concentrate particularly on the proposed standard entitled Commercial Building Grounding and Bonding Requirements for Telecommunications developed by the ad hoc working group, TIA/EIA. The key to the success of the grounding portion of the telecommunications infrastructure as addressed in the subject proposed standard, is based on a ground window concept. The grounding approach recommended in the subject standard, works conceptually for the wiring topology proposed originally in ANSI/TIA/EIA-568 (telecommunications wiring standard) and installed in accordance with ANSI/TIA/EIA-569 (telecommunications pathways and spaces standard).

Descriptors :   *TELECOMMUNICATIONS, *ELECTRICAL GROUNDING, *INFRASTRUCTURE, SYSTEMS ENGINEERING, INFORMATION EXCHANGE, COMMUNICATIONS NETWORKS, STANDARDS, BONDING, LIGHTNING PROTECTION, SYSTEMS ANALYSIS, ELECTRIC CABLES, ELECTRICAL LOADS, STRUCTURAL ENGINEERING, ELECTRICAL ENGINEERING, WIRING DIAGRAMS, ELECTRICAL INSULATION, TELECOMMUNICATION CIRCUITS, CABLE ASSEMBLIES.

Subject Categories : Structural Engineering and Building Technology
      Electricity and Magnetism
      Non-radio Communications

Distribution Statement : APPROVED FOR PUBLIC RELEASE